On the production chain of alloy resistors, the removal of glue is the easiest to overlook, but the coding, welding, and final yield in the later stages all depend on it; If the glue cannot be applied, the size will deviate; If the glue is applied, the body will be damaged - resistance drift, microcracks, edge burrs, and a whole batch will be reworked.
High power alloy resistors like 2512 are not small in size, but the adhesive layer is firmly attached and the thickness is uneven. The difficulty lies not in the strength, but in being the same every time. Guangyue Sheng laser glue remover "alloy resistor single row structure" can remove 24 pieces of glue in 5 seconds.
1. Traditional glue removal, where is it stuck
Mechanical scraping: Scraper, grinding, manual removal, contact force, easy to scratch the electrode and substrate, the smaller the size, the more difficult to control.
Chemical dissolution: solvent soaking, wiping, difficult to quantify process, high pressure on waste liquid and environmental protection, high residual risk.
Ordinary laser, improper energy and pulse width configuration, large heat affected zone, easy carbonization of the adhesive removal edge, and inability to keep up with the production line rhythm.
2. Why does laser glue removal only remove glue without damaging parts
The core of laser debonding is selective absorption: there is a significant difference in the absorption rate of specific wavelength lasers between the adhesive layer and the resistive substrate.
The work process is roughly divided into three steps:
Efficient energy absorption of adhesive layer - laser beam focuses on the adhesive layer area, and the adhesive converts light energy into heat energy in a very short time;
Instantaneous vaporization/peeling - the adhesive layer is vaporized and decomposed, or it breaks away from the substrate under the action of thermal stress or plasma shock waves;
Threshold self-control - the parameters are controlled between "higher than the ablation threshold of the adhesive layer and lower than the damage threshold of the substrate". The adhesive is removed layer by layer, and after exposing the substrate, the substrate itself almost no longer absorbs energy, so it can remain intact.
The actual performance corresponding to the device is: non-contact, no mechanical stress, minimal thermal impact, and the electrical characteristics of the resistor will not be rewritten due to the step of removing the adhesive.
3. The advantages of CKD laser glue remover
The advantages of CKD laser glue remover lie in three words: fast, accurate, and clean. Continuous processing of a single discharge channel can complete the de gluing of 24 2512 alloy resistors in 5 seconds. De gluing is no longer a separate process, and the front and rear sections are seamlessly connected; CCD visual automatic positioning, automatic matching of glue removal lines, synchronous differentiation of good and defective products, residual glue is processed by area, without sacrificing the component body for cleaning; The entire process is dry processed without the use of chemical solvents, scrapers, cleaning cloths, or alcohol. The smoke and dust are sucked and filtered by the built-in vacuum system, saving not only consumables but also the trouble of waste liquid and solvent management. By combining speed, accuracy, and cleanliness, there will be less rework, and the yield rate will naturally stand firm.
